| 摘要 |
PURPOSE:To provide a manufacturing method of a simple and low cost printed wiring board. CONSTITUTION:A conductive thin film 12 removable later and a conductor pattern 13 of a first layer are formed on an insulation base material 11. Then, a resist pattern 14 of a via hole is formed thereon. A metal is buried into a recessed part 15 by electrolytic plating. After having removed the resist pattern 14 and the exposed conductive thin film layer 12, insulation resin is applied all over the whole surface. The coated surface is flattened so that it may be flush with a copper pattern 16. Then, after the conductive thin film 12 is formed on the surface, a second layer conductor pattern 19 is formed. The portion exposed on the surface of the conductive thin film 12 is removed. |
