Apparatus for manufacturing a semiconductor device

摘要

A dispenser unit is provided on one side of a conveying rail and a wafer is provided on the other side of the conveying rail. A tube is attached at one end to the dispensing unit and at the other end to a syringe. First and second shafts are attached at their base ends to the dispensing unit. A satellite roller and movable roller are mounted on the forward ends of the first and second shafts. The satellite roller and movable roller are mounted such that they are rotatable. A movable mechanism is mounted on the dispensing unit to move a semiconductor element from a wafer onto a lead frame. The movable roller is moved to coat a bonding agent on a rear surface of the semiconductor element.