发明名称 IC CARD
摘要 <p>PURPOSE:To easily manufacture an IC card by covering front and rear surfaces of a lead frame having a chip placing unit and an external terminal connector including protrusions with sheets made of vinyl chloride resin and having different thicknesses, and heating and pressurizing it to integrate the three parts. CONSTITUTION:In the case of manufacturing an IC card, a hooplike 42 alloy plate is first continuously drawn at each predetermined pitch by a press to continuously form protrusions 13a for external contact terminals. Then, it is pressed by using a die for a wiring pattern to complete a lead frame 10 having an IC chip placing unit 11, leads 12 and external terminal connectors 13 having the protrusions 13a. A front surface of the frame 10 is covered with a thin surface sheet 22 made of vinyl chloride resin provided with through holes 22a at a positions corresponding to the protrusions 13a, a rear surface of the frame 10 is covered with a thick rear sheet 21 made of vinyl chloride resin, these three are heated and pressurized to be integrated, punched in a predetermined shape to obtain a desired IC card.</p>
申请公布号 JPH06312594(A) 申请公布日期 1994.11.08
申请号 JP19930307437 申请日期 1993.11.11
申请人 IBIDEN CO LTD 发明人 MIURA TAKETOSHI;NAKANISHI TOMOAKI;HIROI ATSUSHI
分类号 B42D15/10;G06K19/077;H01L23/50;(IPC1-7):B42D15/10 主分类号 B42D15/10
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