摘要 |
<p>PURPOSE:To easily confirm printing mask misregistraction by visual check and facilitate position alignment, by forming a punched pattern in the inner layer of a multilayered printed wiring board, so as to keep a specified distance from the outer shape of a carbon contact in the outerlayer. CONSTITUTION:A reference hole is opend in an outer layer 1, and rust prevention of a pattern of an inner layer 2 is performed. The outer layer 1 and the inner layer 2 are laminated and bonded. Through holes 3 are formed and plating catalyst is imparted. A laminate for circuit formation of the outer layer 1 is stuck, and exposure and etching are performed. After copper plating, solder resist 4 is printed. A rectangular punched pattern which keeps a specified distance (d) in four directions of front, rear, right and left from the outer shape of a carbon contact 15 which is printed on the solder resist 4 is formed in a copper foil. When the carbon contact 15 to be printed is misregistraction, the distance between the punched pattern 6 and the outer periphery of the carbon contact 15 becomes narrow in the misregistered direction and becomes wide in the opposite direction. Thereby the distance (d) can be checked with a vernier calipers or by visual check.</p> |