| 摘要 |
<p>PURPOSE:To provide a multilayered printed wiring board wherein insulation deterioration and short circuit between circuits are hard to be generated when imperfect through holes exist, its manufacturing method, and a semiconductor device using the multilayered printed wiring board. CONSTITUTION:The multilayered printed board is provided with the following; a first insulating layer 6a, a first inner layer circuit 4a formed on the layer 6a, a second inner layer circuit 4b facing the innerlayer circuit 4a, insulative adhesion layers 7 formed between the first inner layer circuit 4a and the second inner layer circuit 4b, and a through hole 1 formed in the first insulating layer 6a. An insulating board 9 is formed between the insulative adhesion layers 7. As to the manufacturing method, a prepreg sandwiching the insulating board 9 between the first circuit board 8a and a second circuit board 8b wherein resin is cured is used, and the semiconductor device uses the multilayered printed wiring board.</p> |
