| 摘要 |
PURPOSE:To prevent the bonding deviation at the time of bump bonding with regard to the bump bonding method especially for the photoelectric conversion part and the signal processing part of a hybrid-type infrared-ray detecting element. CONSTITUTION:A bump 1a is formed on one electrode of mutually bonding electrodes. A bump 2a is located at the equally divided position on a circumference separated from the center of the bump 1a of the other electrode. A part of the bump 2a is overlapped with the outer surface part of the plane view of the bump 1a. The bump 2a is formed in this way. The butt bonding is performed in this constitution. |
