| 摘要 |
PURPOSE:To provide the process for production having excellent operability and cost effectiveness by introducing an inert gas to the rear side of a substrate and exposing a photoresist under the increased contact pressure between this photoresist and a photomask, thereby forming resist patterns having high dimensional accuracy. CONSTITUTION:The substrate 10 is placed on a stage 20 having many vent holes 21 on its surface and this stage 20 is risen to bring the photomask 14 formed with patterns of optical circuits into tight contact with the photoresist 13. The front surface of the substrate 10 is pressed to the rear surface of the mask 14 clamped by a supporting base by rising of the stage 20. Further, the inert gas, such as gaseous nitrogen, is introduced between the rear surface of the substrate 10 and the stage 20 through the vent holes 21 on the stage 20 surface and the substrate 10 is pressed to the mask 14 side by utilizing the gaseous pressure to increase the adhesion property between the resist 13 and the mask 14. The resist 13 is exposed in the state of maintaining the mask 14 in tight contact with the resist 13 by utilizing the gaseous pressure in such a manner, by which the patterns of the mask 14 are transferred to the resist 13. |
