LED ARRAY CHIP AND FABRICATION THEREOF

摘要

PURPOSE:To realize a planar edge emission LED array chip having good emission profile conveniently with reduced manhours. CONSTITUTION:A dielectric film 2 is deposited on the surface of a semiconductor substrate 5 and a part of the dielectric film 2 is removed by etching to make a diffusion window 6 through which impurities are diffused to produce a PN junction. A P side electrode 3 is then deposited while covering the diffusion window 6 entirely. Subsequently, the PN junction is split in the center of the diffusion window 6 so that the PN junction appears at the end of the chip thus obtaining a planar edge emission LED array chip. A high quality LED array chip can be fabricated conveniently with no machining damage while reducing the manhour by employing a planar LED. Furthermore, since the light is collected only in the direction of short plane, light distribution characteristics effective for writing can be obtained.