| 摘要 |
PURPOSE:To provide a manufacturing method for electronic parts, which can realize the improvement of working efficiency and the low cost. CONSTITUTION:A metal mold 3 comprising an upper die 5 and a lower die 6 and a protruding pin 4 slidably inserted into the lower die 6 are provided. The protruding pin 4 is made to face the center of the cavity part formed on individual recess parts 5a and 6a at the upper die 5 and the lower die 6. A resin sealing metal mold 1, wherein a recessed spherical surface 4c is formed as the concave surface at the tip surface of the protruding pin 4, is used. The chips of light emitting diodes and a circuit part 2b such as a terminal are arranged in the cavity part of the metal mold 1. A resin is injected into the cavity part. After the elapse of the specified time, a light emitting diode 2, wherein the circuit part 2b is sealed with a resin molded part 2a, is made to protrude and removed from the metal mold 3 with the protruding pin 4. At the same time, a convex lens 2c is moded at the resin molded part 2a with spherical recessed part 4c of the protruing pin 4. |
