| 摘要 |
PURPOSE: To dissipate a large quantity of heat by providing a semiconductor die coupled to a first surface of a lead frame and an external heat spreader including a low thermal resistance material coupled to a second surface of the lead frame. CONSTITUTION: A die 305 is surrounded by a mold compound 306 on one side thereof, and is surrounded by a lead frame 310B and a heat spreader 302 on the other side thereof. Almost all of heat produced with the die 305 passes through the mold compound 306 or the lead frame 301B and the heat spreader 302. The lead frame 301B and the heat spreader 302 are made of a high thermal conductivity material and the mold compound 306 has a relatively low thermal conductivity so that almost all of heat is dissipated through the lead frame 301B and the heat spreader 302. The material used for the heat spreader 302 has a high thermal conductivity so that heat of a package is more easily dissipated. |
