Composite boards, based on carbon fibres in a copper matrix, and their methods of manufacture

摘要

The invention relates to composite boards, based on carbon fibres in a copper matrix, having both good thermal conductivity and a low coefficient of expansion in order to be used as a support for ceramic substrates carrying electronic components. The subject of the invention is a board obtained by hot-pressing a flexible composite formed by a stack, between two copper foils (shims) 1, 2, of superposed mats 3, 4, 5, 6 of long carbon fibres 10 with crossed orientations, these fibres being electrolytically coated with copper.