| 摘要 |
<p>PURPOSE:To provide a protective-film formation method which is suitable for automation by a method wherein a protective film is formed efficiently on the prescribed face of a chip component. CONSTITUTION:When protective films are formed on side-face parts excluding edges 5 on surfaces of chip-shaped element assemblies 4, jigs 1, 2 having rectlinear housing grooves 3 whose shapes correspond to side-face shapes of the chip-shaped element assemblies 4 are prepared, the chip-shaped element assemblies 4 are housed in the housing grooves 3 in the jigs 1, 2, and the edges 5 are brought mutually face to face and placed side by side in the lengthwise direction. In this state, a protective-film raw material is put from the upper side of the housing grooves 3, it is applied to the side faces of the element assemblies 4 and the protective films are formed on two side faces of each element assembly 4.</p> |
