| 摘要 |
PURPOSE:To form a micro-contact having a small diameter. CONSTITUTION:A high tensile strength copper alloy thin wire (w) or the like is composed of 0.02-0.7wt.% Fe, P in the content 15-80wt.% of the Fe, Zr and In in 0.01-0.5wt.% individually or in total amount, and the remainder consisting of copper, protruded a certain length from the tip of a capillary 10 of a wire bonder, and melted with electric discharge using an electric torch 12 so that a ball (a) is formed. This ball (a) is pressed to a contact base B heated to 200-300 deg.C to generate pressure attachment. This pressing motion takes place once again, and the thin wire (w) is grasped by a clamp 11, pulled up, and torn off from the neck of the ball (a) in pressure attachment so that a bump a' is formed on the contact base B. A punch 13 is butted with this bump a' so that the surface is made spherical (columnar), and a contact (t) of 60-200mum is obtained, see figs. i, j in attached illustration. |
