| 摘要 |
<p>PURPOSE:To provide a highly reliable IC card which can be easily and automatically assembled and produced in a simple process by shielding a circuit substrate with a pair of conductor panels which cover both sides of the circuit substrate. CONSTITUTION:When an electronic circuit substrate 12 is put into the inside frame part of a frame 1 in the direction shown by an arrow, the tip of the substrate 12 is automatically held between the part 3 and a contact part 2b of a leaf spring 2. The part 2b has the elastic force and is pressed to the surface of the substrate 12 by the restoring force of the spring 2. The placing position of the spring 2 is considered so that a contact is secured bwtween the earth line of the GND terminal of the substrate 12 and the part 2b. A contact part 2a and a contact part 2c touch an upper panel 14 and a lower panel 15 respectively when both panels 14 and 15 are placed on the frame 1. Therefore, the electric connection is secured between both panels 14 and 15 and the earth line of the substrate 12 respectively via the spring 2 in an assembled state, and the substrate 12 can be shielded.</p> |
