SEMICONDUCTOR PACKAGE AND ITS MANUFACTURE,申请号JP19930123521-传众专利搜索

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发明名称	SEMICONDUCTOR PACKAGE AND ITS MANUFACTURE
摘要
申请公布号	JPH06310621(A)	申请公布日期	1994.11.04
申请号	JP19930123521	申请日期	1993.04.27
申请人	NIPPON STEEL CORP	发明人	IMADA MASAFUMI
分类号	H01L21/56;H01L23/28;H01L23/29;(IPC1-7):H01L23/28	主分类号	H01L21/56
代理机构		代理人
主权项
地址

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