| 摘要 |
PURPOSE:To provide a multilayered printed wiring board wherein insulation deterioration and short circuit are hard to be generated when imperfect through holes exist, its manufacturing method, and a semiconductor device using the multilayered printed wiring board. CONSTITUTION:The multilayered printed board is provided with the following; a first insulating layer 6a, a first inner layer circuit 4a formed on the layer 6a, a second inner layer circuit 4b facing the innerlayer circuit 4a, an insulative adhesion layer 7 formed between the first inner layer circuit 4a and the second inner layer circuit 4b, and a through hole 1 formed in the first insulating layer 6a. A region 2 of the second inner layer circuit 4b which the through hole 1 faces is made an insulating channel 5. As to the manufacturing method, a second circuit board 8b wherein the insulating channel 5 is formed in the region 2 of the second inner layer circuit 4b which the through hole 1 faces is used, and the title semiconductor device uses the multilayered printed wiring board. |
