发明名称 MANUFACTURE OF MULTIWIRED BOARD
摘要 PURPOSE:To prevent generation of floating and movement of an insulated wire, by a method wherein light-setting type resin is applied to a not-yet cured state resin layer of the outermost layer of the insulated wire, and a board is heated after the light-setting type resin layer of the insulated wire is completely cured by irradiating the front surface of a board surface after wiring with light. CONSTITUTION:An insulated wire having a light-setting type resin layer in a not-yet cured state outside the insulating layer is used as an insulated wire. After the insulated wire is wired on a board, the front surface of the wired board surface is irradiated with light, and the light-setting type resin layer of the insulated wire is completely cured. Further the board is heated and a thermosetting type adhesive resin layer is cured. As the core conductor, copper and copper alloy can be used. As the lead wire plated with gold, silver, tin, etc., or an aluminum wire or an aluminum alloy wire or a twisted wire of them also can be used. As the insulative material for coating, polyimide resin, polyamid-imide resin, fluororesin, polyester resin, etc., can be used.
申请公布号 JPH06310864(A) 申请公布日期 1994.11.04
申请号 JP19930097728 申请日期 1993.04.23
申请人 HITACHI CHEM CO LTD 发明人 NAKAZATO YUICHI;ARIGA SHIGEHARU
分类号 H05K3/10;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/10
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