| 摘要 |
PURPOSE:To provide a molded-package type hybrid IC that is appropriate for high-density mounting, with no fear of wire discontinuity at mounting. CONSTITUTION:Relating to a molded-package type hybrid IC wherein a circuit substrate 1 on which circuit components 4 and 5 are mounted is molded so that it is sealed in a molding resin 7, and an external connection pin terminal 6 is led out of the molding resin 7, one end of the pin terminal 6 is bonded to a plate face of the circuit board 1, and the other end led out of the molding resin 7.
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