| 摘要 |
PURPOSE:To provide a method for manufacturing an electric connecting device which can realize an electric connecting device easy to perform the electric connection and electric breakage of an integrated circuit device or a circuit board, having high reliability, and capable of precisely forming connecting pins in a fixed position with a high density. CONSTITUTION:Gas deposition for carrying an aerosol containing metal ultra- fine particles formed by evaporating a metal such as copper, gold, silver, platinum, aluminum, nickel, molybdenum, or tungsten in a gas of Ar or He, and injecting it toward a base 1 or 4 through a nozzle at high speed to accumulate, for example, a metal such as copper is carried out to form a female connector 3 and a male connector 6 on the base 1 and the base 4 with high aspect ratios, respectively, and the female connector 3 of the base 1 is connected to the male connector 6 of the base 4. |
