MANUFACTURE OF ELECTRICAL/OPTICAL WIRING BOARD

摘要

PURPOSE:To cut down the manufacturing manhours for increasing the yield by a method wherein an optical waveguide and electric wiring formed on a carrier film are bonded onto an electrical/optical photowiring board using a bonding agent and then peeled off to be transferred to the electrical/optical wiring board. CONSTITUTION:A teflon sheet 11 for a carrier film having low bond properties onto a metal or resin is used so as to form a copper wiring 15 and an optical waveguide 19 thereon. Furthermore, a bonding agent 21 is formed on a ceramic wiring board 20 to be opposed to the electric wiring 15 and the waveguide 19 and after making alignment with one another for bonding step, the teflon sheet 11 is peeled off so as to transfer the electric wiring 15 and the waveguide 19 formed on the teflon sheet 11 to the ceramic wiring board 20. Through these procedures, the manufacturing manhours can be cut down thereby enabling the yield to be increased.