| 摘要 |
<p>PURPOSE:To improve yield, increase treatment capacity of plating machining, and reduce maintenance operation time by providing an electrode so that it contact the circumferential part outside the region where the chip of a semiconductor wafer is formed through a packing liquid-tightly. CONSTITUTION:An electrode tip part 34 liquid-tightly contacts a semiconductor wafer 25 held by a tool substrate 22 and a support plate 23 at the circumferential part outside the region where the chip of the semiconductor wafer 25 is formed while a contact pin 35 of an electrode part 32 is through a packing 28. Therefore, when the semiconductor wafer 25 is held by a retention tool 21 when performing plating machining to the chip-formation region on the main surface of the semiconductor wafer 25, the packing 28 is adhered to both, thus preventing the electrode tip part 34 in contact with the semiconductor wafer 25 through the packing 28 and the electrode contact part of the semiconductor wafer 25 from contacting a plating liquid and hence preventing the electrode tip part 34 damaging the chip-formation region.</p> |
