HOLDING MATERIAL FOR SEMICONDUCTOR WAFER,申请号JP19930099913-传众专利搜索

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发明名称	HOLDING MATERIAL FOR SEMICONDUCTOR WAFER
摘要
申请公布号	JPH06310709(A)	申请公布日期	1994.11.04
申请号	JP19930099913	申请日期	1993.04.27
申请人	TOSHIBA CORP	发明人	TAYA TOYOHIRO
分类号	H01L29/78;(IPC1-7):H01L29/78	主分类号	H01L29/78
代理机构		代理人
主权项
地址

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