| 摘要 |
PURPOSE:To manufacture a multilayer wiring board in less positional error by a method wherein a conductor in triangular shape as an outer peripheral is simultaneously arranged on the outer periphery of an inner layer circuit when the circuit of the inner layer circuit board is formed. CONSTITUTION:An etching resist is stuck on both surface of a 0.2mm thick glass epoxy resin Cu plating laminated board. Next, specific pattern and triangular outer peripheral conductor frame are formed on both surfaces of an inner layer board by patterning the etching resist to be etched using a negative film arranging a triangular outer peripheral frame pattern on a circuit pattern and the outer periphery. Next, 0.1mm thick glass fiber epoxy resin prepreg is inserted into the inner layer circuit plate. Furthermore, successive inner layer circuit plate is aligned to be arranged. Next, a bonding sheet and a 18 micron copper foiled mirror plate are arranged on both sides of the inner layer circuit. Next, the whole body is thermal pressure fixed for 90min at molding temperature of 170 deg.C and forming pressure of 4 MPa to obtain a 0.8mm thick six layer multilayer wiring board. Through these procedures, the multilayer wiring board in less positional error to be manufactured. |
