| 摘要 |
The invention relates to a soldering device, in particular for the soldering points on individual circuit boards, small batches or the like, having at least one tank for liquid soldering tin and at least one soldering head, connected to the tank, for flowing soldering tin discharging at the soldering head. The essence of the invention consists in the fact that the interior of the tank containing the liquid soldering tin is filled above the surface of the soldering tin with a subsequent flow of protective gas, and that the soldering head is arranged in such a way that the protective gas flows around it and that it is nonetheless at the same time accessible for soldering work to be carried out.
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