| 摘要 |
<p>The electronic component heat sink comprises a housing formed of a heat sinking material and contg. a printed circuit wiring board and a number of heat generating components. At least one carrier is provided, upon which the components are supported, and which is attached to the printed circuit wiring board. A cover panel closes an open end of the housing, and at least one spring has a number of spring fingers pressing the electronic components into a non-electrically conductive, heat exchange relationship with an inner wall surface of the housing. A heat conductive, electrically insulating film is disposed between the electronic components and the inner wall surface of the housing. The spring is mounted to an inner side of the cover panel, and the carrier has a deflection surface device for deflecting the spring fingers to prevent them from pressing down on the electronic components as the cover is being positioned onto the housing. The spring fingers may be freely engaged at a side of the electronic components once the cover is in position closing the open end of the housing.</p> |
