| 摘要 |
The invention relates to a method of encapsulating electronic components (1) mounted, according to a hybridation technique by balls, on a substrate (3). It further relates to the encapsulated electronic component obtained by implementing this method. This method consists: - in arranging balls (6a, 6b, 6c, etc.) on the substrate, around an electronic component in order to form a carpet of balls (6) which is contiguous with the said electronic component; - in depositing at least one drop (7) of an encapsulating substance on the carpet of balls, the balls of the carpet impregnated with the surface being able to make this substance migrate by capillarity, towards the balls situated between the said electronic component and the substrate. Application in microelectronics, computing and optoelectronics. <IMAGE> |
