SILICEOUS COMPOSITE PARTICLES AND THEIR USE

摘要

PURPOSE:To provide siliceous composite particles having heat conductivity comparable to that of high heat conductivity ceramics and low thermal expandability comparable to that of molten silica and especially suitable for use as a filler for an LSI sealing resin. CONSTITUTION:Inner layers of a silicate compd. and outer layers of high heat conductivity oxide ceramics are formed on the surfaces of silica glass particles, respectively, to obtain the objective siliceous composite particles. These siliceous composite particles are preferably used as a filler for an LSI sealing resin when the silicate compd. is mullite and the oxide ceramics is alumina.