| 摘要 |
A method for troubleshooting an electronic circuit board assembly which comprises a plurality of components interconnected by a plurality of nodes having electrical terminals without the need to de-solder. The method comprises measuring the resistance value for one of the plurality of nodes, and, if the measured resistance value does not match a target value, individually cooling or heating each of the components which are coupled to such node while simultaneously measuring the resistance value for the node, and identifying as faulty that component for which the measured resistance deviates most from the target value.
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