| 摘要 |
PURPOSE:To improve heat dissipation efficiency of an electronic circuit device by joining a wiring metal layer onto top surface of a thermal-resistant insulating base plate and electrode surface of an electronic part onto the rear surface thereof, and also by providing the base plate with a piercing hole. CONSTITUTION:An Al wiring 3 is formed on the surface of a polyimide film 1 supported by a frame of copal, etc., which also serves the purpose of an external lead, an LSI chip, etc., 4 is attached 6 onto the rear surface, and the LSI's surface electrode 5 and the wiring 3 are connected through a piercing hole 2. The hole is to be provided in a tapered shape so that line breakage can be prevented. Further, a film's rear surface and sides of chips 4 and 4' are attached onto the surface of the attached layer 6 using an epoxy resin 10. Now, approximetely 2-5mu of Al 7 is soldered to provide a cooling body. By employing this method, it is possible to prevent shortcircuit by a pinhole 9 to be generated at the time of formation of the piercing hole 2.
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