发明名称 Rackless rack for electroplating
摘要 A rack for electroplating contains a plurality of windows for receiving an article to be electroplated. The rack is rotatably mounted to a frame connected to a cathode of a power supply. A portion of the border of each window is made of a conductive article which is connected to the cathode via the frame. Mesh screens flank each side of the windows, retaining the article within its borders. A series of non-conductive drive gears rotate the rack, moving the article to different contact points along the window. During electroplating, the movement of the article insures that the entire surface of the article is plated, thereby avoiding rack marks. The window's conductive elements divert metal ions away from the edge of the article, thereby offsetting the natural buildup of ions along the edge and increasing surface uniformity. The ratio of the thickness of the window's conductive elements to the thickness of the article are adjusted to produce an edge to center ratio of less than one, equal to one, or more than one.
申请公布号 US5360527(A) 申请公布日期 1994.11.01
申请号 US19930055859 申请日期 1993.04.30
申请人 HITACHI MAGNETICS CORP. 发明人 RIBITCH, RAYMOND W.
分类号 C25D17/08;(IPC1-7):C25D17/08 主分类号 C25D17/08
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