发明名称 Method of fabricating a semiconductor device
摘要 Between electrodes (9) and (10) are formed a p+ substrate (2), an n- epitaxial layer (1) having a protruding portion (3), an n+ diffusion region (4) and p+ diffusion regions (13). Control electrodes (6) are formed on insulating films (5) on opposite sides of the protruding portion (3) and n+ diffusion region (4). The potential at the control electrodes (6) is increased or decreased with the potential at an electrode (10) increased relative to an electrode (9) to generate potential barrier or conductivity modulation in the n- epitaxial layer (1), whereby a semiconductor device turns off or on. Introduced holes are drawn through the p+ diffusion regions (13) when the semiconductor device turns off, to provide a small resistance and a short distance when the holes are drawn without changes in the area of the n+ diffusion region (4). This permits the semiconductor device to have small switching loss and high switching speed with a low ON-voltage.
申请公布号 US5360746(A) 申请公布日期 1994.11.01
申请号 US19940193742 申请日期 1994.02.09
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 TERASHIMA, TOMOHIDE
分类号 H01L29/744;H01L21/329;H01L29/739;H01L29/74;H01L29/78;(IPC1-7):H01L49/00 主分类号 H01L29/744
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