| 摘要 |
PURPOSE:To increase an adhesion of a substrate electrode to a substrate by using a low-resistance copper film as the substrate electrode in an image forming device. CONSTITUTION:Substrate electrodes 4, 5 provided on the top and rear surfaces of a glass substrate 2 are electrically connected to each other by being clamped by a resilient clip terminal 12. Part of the surfaces of the substrate 2 to be provided with the electrodes 4, 5 is roughened to have a higher adhesion to the electrodes 4, 5. As the electrodes 4, 5, a laminate with a copper film plated on a nickel prime-coating film is used. |
