| 摘要 |
PURPOSE:To provide an electronic component mounting device which can be used for the efficient production of electronic components. CONSTITUTION:The mounting device is provided with a control section 10 which inputs the thickness data of electronic components upon mounting the electronic components, makes the components to be mounted after sorting the parts by comparing the inputted thickness data with a thickness tolerance suitable for mounting the components, and changes the thickness tolerance by adding the thickness data suitable for mounting the components to the inputted thickness data and alarming means 11 which issues an alarm when the thickness of the electronic components detected by means of a components thickness detecting section is out of the tolerance at the time of mounting the components. Therefore, the thickness tolerance can be automatically changed in accordance with the thickness variation of the electronic components and, when a mounting head cannot attract electronic components by suction in a normal attitude, the situation can be easily recognized, because an alarm is issued. |
