MULTILAYER PRINTED WIRING BOARD

摘要

PURPOSE:To shorten the distance between the centers of lands in a high-density wiring circuit. CONSTITUTION:In the wiring board in which lands on an inner- and other-layer substrates are electrically connected to each other by means of conductive paste filling up connecting holes formed in both substrate in a state where the holes are communicated with each other, the distance between the center of the land 17 of a blind via hole 11 and the center of the land 15 of a through via hole 12 is made shorter as compared with circular lands of the same areas by forming the lands 17 and 15 in rectangular shapes and so that the lands 17 and 15 can be brought nearer to each other.