| 摘要 |
PURPOSE:To provide production method by which the coverage of a barrier metal for a contact hole with a large aspect ratio can be improved. CONSTITUTION:A barrier metal 5 which is piled up on the surface of a substrate 1 is scattered on its periphery by reverse sputtering and the surface of the substrate 1 is covered with a metal constituting the metal 5. Therefore, a contact hole 4 can be thoroughly covered with the metal 5 in an appropriate state, especially the defective coverage of the metal 5 can be prevented even on the corners of the hole 4. |
