MATERIAL HANDLING DEVICE FOR MANUFACTURING ELECTRONIC COMPONENT

摘要

PURPOSE:To obtain material handling device for manufacturing electronic components which can surely set a lead frame after directing the frame towards a prescribed groove irrespective of the shape of a head section. CONSTITUTION:Clamper bars 2 are closed (m6 and m7) to a clearance 2d smaller than the width 4d of a head section 4 and larger than the thickness 3d of a lead frame 3 so that the bars 2 can hold the lead frame 3 between them while a clamper 1 clamps the head section 4. When the head section 4 is released from the clamper 1, the frame 3 drops down and the lower surface of the section 4 is caught by the bars 2. Then the frame 3 is put in a groove 5a by raising a loading bar 5 (m3) and the bars 2 are opened (m8 and m9). Finally, the loading bar 5 is lowered (m4) and the frame 3 is put in the groove 7a of a frame guide 7.