| 摘要 |
PURPOSE:To achieve high reliability by forming a recessed part that reflects the light of a light emitting element on a lead frame, fixing the light emitting element on the bottom of the recessed part, using a sealing plastic whose adhesiveness with the light emitting element at the recessed part is lower than that at the other part and protecting the light emitting element from the stress by the sealing plastic. CONSTITUTION:To fix a light emitting element to the bottom of the recessed part, conductive paste 4 is cured at 200 deg.C for 1 hour, a curing gas generated from the conductive paste 4 at this time is allowed to adhere to the periphery of the light emitting element 1 at the recessed part 3 and it is sealed with the sealing plastic 5. Thus a light emitting diode is fabricated. In this case, for example, CRM-1037 is used as the conductive paste 4 and HL8000 as the sealing plastic 5. The curing gas generated from the comductive paste 4 is a low molecular weight gas from reactant type diluent. By this the stress of the sealing plastic does not affect the light emitting element and the reliability of the light emitting element is remarkably improverd. |
