发明名称 PREPARATION OF SOLAR CELL BASED ON WAFER SUBSTRATE
摘要 PURPOSE: To provide a method of manufacturing solar cells with wafer substrate suited for the mass production by possibly contacting solar cells from the bath side. CONSTITUTION: Through-holes 4 are formed in a wafer substrate by the electrochemical etching to form an n-doped single crystal Si perforated cantilever layer 7 in which n-doped regions 10, 13 and p-doped regions 9 are formed to form p-n junctions adjacent to a first main surface 2 of the cantilever layer 7. On the first main surface 2 contacts 15 corresponding to the n-doped regions 10, 13 and contacts 14 corresponding to the p-doped regions 9 are formed to result in that the p-n junctions act as solar cells capable of light incidence to through a second main surface 52 opposite to the first surface 2.
申请公布号 JPH06302839(A) 申请公布日期 1994.10.28
申请号 JP19940082550 申请日期 1994.03.28
申请人 SIEMENS AG 发明人 FUORUKAA REEMAN;YOOZEFU UIRAA;UORUFUGANGU HENRAIN
分类号 H01L31/0224;H01L31/0352;H01L31/047;H01L31/18 主分类号 H01L31/0224
代理机构 代理人
主权项
地址