发明名称 |
PREPARATION OF SOLAR CELL BASED ON WAFER SUBSTRATE |
摘要 |
PURPOSE: To provide a method of manufacturing solar cells with wafer substrate suited for the mass production by possibly contacting solar cells from the bath side. CONSTITUTION: Through-holes 4 are formed in a wafer substrate by the electrochemical etching to form an n-doped single crystal Si perforated cantilever layer 7 in which n-doped regions 10, 13 and p-doped regions 9 are formed to form p-n junctions adjacent to a first main surface 2 of the cantilever layer 7. On the first main surface 2 contacts 15 corresponding to the n-doped regions 10, 13 and contacts 14 corresponding to the p-doped regions 9 are formed to result in that the p-n junctions act as solar cells capable of light incidence to through a second main surface 52 opposite to the first surface 2. |
申请公布号 |
JPH06302839(A) |
申请公布日期 |
1994.10.28 |
申请号 |
JP19940082550 |
申请日期 |
1994.03.28 |
申请人 |
SIEMENS AG |
发明人 |
FUORUKAA REEMAN;YOOZEFU UIRAA;UORUFUGANGU HENRAIN |
分类号 |
H01L31/0224;H01L31/0352;H01L31/047;H01L31/18 |
主分类号 |
H01L31/0224 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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