| 摘要 |
<p>PURPOSE:To avoid contamination of a wafer due to adhesive of an adhesive tape and an environmental contamination due to processing. CONSTITUTION:The method for processing a semiconductor wafer comprises the steps of bonding an adhesive tape formed by combining a base material 1 of a water soluble film for back grinding, dicing the wafer and/or water soluble adhesive layer 2 to the wafer 4, mixing it, after the previous step is finished, with water to clean it, thereby dissolving or dispersing the material 1 and the layer 2 to be removed, and completely removing contaminant remaining on the surface of the wafer 4.</p> |
