LEAD FRAME AND MANUFACTURE THEREOF

摘要

PURPOSE:To provide a lead frame in excellent bond properties onto a sealing regin capable of shortening a bonding wire shifted downward in good flatness without tilting and warping the prospective chip mounting part in a pad. CONSTITUTION:Within the title lead frame 1 lowering the prospective chip mounting part 7 in a pad 5, slits 8 excluding the corner parts thereof in the oblique directions are formed outside said part 7 so that the prospective chip mounting part 7 may be lowered by bending the intermittent corner parts 9 wherein the slits 8 are not bored.