WIRING BOARD AND ITS MANUFACTURE

摘要

PURPOSE:To easily obtain a wiring board having a composite function by improving the adhesive property between a wiring pattern and substrate so as to eliminate the need of heating operation for improving the adhesion between the pattern and substrate. CONSTITUTION:At the time of forming a wiring pattern on a substrate 10 with an adhesive layer and barrier layer in between, a conductor pattern 12 is formed by etching a conductor layer and tantalum nitride layer 14 after successively forming the layer 14 and the conductor layer on the substrate 10 and, at the same time, resistors 18 are formed in a circuit by utilizing unetched parts of the layer 14 as resistor sections 18b.