IC SOCKET AND CONTACT THEREFOR

摘要

PURPOSE: To provide an IC socket which can connect a dual inline (DIP) IC packages while laminating the DIP IC packages and to provide a contact to be used for the socket. CONSTITUTION: A flat contact 30 is inserted into an aperture 6 of an insulating base 10 having a large number of apertures 6 in a side rim. The contact 30 comprises a main body part 34 uprightly erected from the aperture 6 and an approximately V-shaped elastic leg part 32 laid transversely in the bottom face of the insulating base 10. A solder layer 38 is formed on done face of the main body part 34 and a plurality of IC chips 20 are laminated and made possible to be connected by soldering. The elastic leg part 32 is surface-mounted (SMT) on a circuit trace 45 of a substrate 50.