| 摘要 |
PURPOSE:To enable a package to be miniaturized while the freedom in the pad arrangement of a semiconductor to be extended. CONSTITUTION:In order to form a package by joining a cap 12 as if self- containing a semiconductor chip 3 with a base 9 mounting the semiconductor chip 3, respective wires 11 are led out perpendicularly to the pad of the semiconductor chip 3 while through holes 14 are bored in the cap 12 enabling the wires 11 to be externally expoded and then the wires 11 and leads 15 are connected and sealed at the outlets of these through holes 14 by a soldering step. |
