| 摘要 |
PURPOSE:To provide a resin-sealed semiconductor device with a plurality of IC chips each having an equal heat dissipating capacity. CONSTITUTION:The resin-sealed semiconductor device is composed of respective IC chips 1A, 1B and a plurality of inner leads 3 and outer leads 4 electrically connected to respective IC chips 1A, 1B to be resin-sealed respectively in parallel with the outer leads 4. |
