SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND BONDING METHOD

摘要

PURPOSE:To make it possible to carry out bonding work even when bonding pads are dispersively laid out by providing a hole which serves as a bonding means formed on a film and installing a lead frame in such a fashion that the lead frame may serve as a film which can be interconnected. CONSTITUTION:There are provided a film 50, which is a base, an in-film wiring part of the film 50 and a hole 4 which serves as a bonding means formed on the film 50. The in-film wiring part 50 wired in the films wiring lead frame by way of the hole 4 which is a bonding means installed to a film wiring lead frame 10 is bonded with bonding pads 6 on a chip 200 with a bonding wire 7. This construction makes it possible to bond the bonding pads 6 even if they are dispersively laid out on the chip 200, which is quite impossible to bond according to a prior art bonding method. This bonding method is applicable to every semiconductor integrated circuit device which need for bonding.