ELECTRONIC STRUCTURE INCLUDING JUNCTION STRUCTURE WITH LOW CAPACITIVE LOAD

摘要

PURPOSE: To provide an electronic structure having a junction configuration causing a minimum parasitic electrostatic capacity. CONSTITUTION: An electrically interconnected structure 44 includes a plurality of stacked substrates 22 electrically interconnected. Associated contact pads 26 and 28 of the adjacent substrates are electrically connected each other. The adjacent joint locations are thermo-compressed and coupled each other. In order to reduce a parasitic electrostatic capacity between the contact pads of the substrates and electric conductors 30, the contact pads of the substrates are made to have an elongate shape. It is preferable that the elongate contact pads or grating pads of the adjacent substrates are not parallel and perpendicular to each other. Thereby, even when the associated contact pads of the adjacent substrates not uniform at the time of manufacturing the structure are arranged, the substrates can be interconnected with intersection regions whose positions vary along the elongate contact pads.