| 摘要 |
PURPOSE:To enable wire bonding to be carried out to the immediate neeghborhood of an IC chip by removing an extra paste in a simple and easy way. CONSTITUTION:A tape 8 with a slit is preliminarily installed to a die pad outside a loading part of an IC chip 1. When the chip is fixed after it is coated with resin paste 6, extra paste spread on the tape 8 is removed simultaneously when the tape 8 is peeled off, which makes it possible to carry out wire bonding in an area directly near the chip. |
