| 摘要 |
PURPOSE:To improve the heat dissipation effect of an LIS on a ceramic multilayer board as well as to provide the simplification of a process of manufacturing the ceramic multilayer board. CONSTITUTION:Heat, which is generated when an LSI 9 mounted on a ceramic multilayer board 7 is actuated, is dissipated. In an LSI heat dissipation structure on the board 7, a high-heat conductivity elastic sheet 11 having an external shape a little smaller than the inner diameter of pad parts for LSI wire bonding is mounted on the surface of the LSI 9 and moreover, a fin 14 for heat dissipation is mounted via this sheet 11. |
