PACKAGE STRUCTURE OF SILICON CHIP CAPACITOR,申请号JP19930112151-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	PACKAGE STRUCTURE OF SILICON CHIP CAPACITOR
摘要
申请公布号	JPH06302462(A)	申请公布日期	1994.10.28
申请号	JP19930112151	申请日期	1993.04.15
申请人	MITSUBISHI MATERIALS CORP;MITSUBISHI MATERIALS SHILICON CORP	发明人	TACHIBANA KANICHI;INUKAI TAKAO;MURAKAMI YOSHIO;ABE HIDENOBU
分类号	H01G4/08;(IPC1-7):H01G4/08	主分类号	H01G4/08
代理机构		代理人
主权项
地址

您可能感兴趣的专利

Method for selectively playing back programs recorded on a video tape

Retroviral protease inhibitors

L-shaped support beam with demountable wheeled container

Transcriptional cofactor DCoH

Methods of inhibiting the activation of Factor XIII

Printhead array and method of producing a printhead die assembly that minimizes end channel damage

Power converter

Modular intramedullary nail

Constant-flow irrigation tape and method of making

AUTOMATIC CLUTCH DEVICE FOR HYDROSTATIC PRESSURE TYPE CONTINUOUSLY VARIABLE TRANSMISSION

Laminated dielectric resonator and filter

Easily expandable transport stream encoder

Curved surface generating method and apparatus therefor

Method of expanding differential PCM data of speech signals

Image processing method and apparatus for obtaining object data to reconstruct the original image

Receiver controlled communication system

Electronic calendar display device

Dual coil voice coil motor