NON LEAD SOLDERING IN A SUBSTANTIALLY OXYGEN FREE ATMOSPHERE

摘要

Non lead solders are presently begining to replace existing lead based solders to avoid the use of lead. A process of soldering an element is defined which comprises the steps of supplying solder having a lead content less than 37 % by weight to surfaces on the element to be solder coated or solder joined, and blanketing the surfaces during soldering in a substantially oxygen free atmosphere. The elements may be populated or unpopulated circuit boards and the soldering may be wave soldering or reflow soldering.